|
Size |
OEM |
Model |
Description |
|
|
ADVANTEST |
T3324 |
264 pin system |
|
|
ADVANTEST |
T3326 |
Advantest T3326 tester |
|
|
ADVANTEST |
T5362 |
ADVANTEST SYSTEM MMFS11 |
|
|
AETRIUM |
AETRIUM 5600 |
Wafer handler |
|
|
ALLTEQ |
LFI3000 |
WIRE INSPECTOR |
|
6" |
AMAT |
9200 |
Ion Implanter |
|
6" |
AMAT |
AMS2100 |
Atmospheric CVD AMS2100 202; |
|
|
ASECO |
Wafer handler |
Wafer handler |
|
6" |
AUDIONVAC |
AUDIONVAC 301 |
Vacuum Sealer |
|
8" |
Axcelis |
200PCU |
PoLo Single Chmbr UVBake |
|
8" |
AXIOTRON |
740207 |
MICROSCOPE |
|
12" |
BA |
Fab Express |
Wafer handler |
|
|
BGA |
Singulation system |
BGA SINGULATION SYSTEM |
|
6" |
BioRad |
BioRad QS-500 |
Epi film thickness measurement |
|
8" |
BioRad |
BioRad QS-500 |
Epi film thickness measurement |
|
|
Brilliant |
Multi plunger |
BRILLIANT 100 MULTI PLUNGER MOLD |
|
|
DAYMARC |
3087 |
Wafer handler |
|
|
Delta design |
2040 |
RFS handler |
|
|
DELTA |
Flex |
DELTA FLEX PICK& PLACE HANDLER |
|
|
Despatch |
LAC1-38B-4 |
HTRB OVEN (ID# DS5) |
|
|
DIAS |
IS-22 |
DIAS' INSPECTION STATION |
|
|
Disco |
918 |
918 WAFER DICING SYSTEM |
|
6" |
DMS |
reticle stocker |
Reticle Stocker, 5" reticles |
|
8" |
DYMATIX |
1044B |
Pick and Place |
|
6" |
DYN OPTICS |
325R |
Reflectometer |
|
|
Eaton |
Eaton 10-80 |
Ion Implanter |
|
8" |
Edwards |
GRC D150 |
GRC Cartrides & D150, Gas abatement |
|
|
ESEC |
2005 |
Die Bonder |
|
|
ESEC |
3008 |
Wire bonder, vintage 2000 |
|
|
ESEC |
Autoline 20M for SOIC |
Die bonder |
|
|
ESEC |
ESEC 2006HR |
ESEC DIE BOND SYS (2006PI) |
|
|
ESEC |
ESEC 2006PI |
ESEC DIE BONDER WITH SERIAL NO.3_36 |
|
|
ESEC |
ESEC 3008 |
Wirebonder |
|
|
ETS |
ETS4-2SW |
THERMAL SHOCK CHAMBER |
|
|
FICO |
FICO |
Mold |
|
|
Fortrend |
F-6350 Wafer transfer |
Wafer Transfer System |
|
|
GATAN |
656 |
DIMPLE GRINDER |
|
6" |
GCA |
DSW8500R |
GCA Stepper |
|
|
GPZett |
Auto molding system |
GPZETT AUTO MOLDING SYSTEM- 132LD |
|
|
GSM |
GS-5000DB |
GRID SCANNER |
|
|
GSM |
Placement system |
UNIVERSAL GSM PLACEMENT SYS(W/INSTALL) |
|
|
HEWLETT PACKARD |
E1401A/ E1411B/E1353A |
Solder joint tester |
|
|
Hewlett Packard |
HP83000 -120T |
120MHz , 320 pins , 4M , 8 GPDS , WS J210XC , HP-UX |
|
|
Hitachi |
S5000H |
STEM |
|
6" |
HORIBA |
PD3000 |
RETICLE / MASK PARTICLE DETECTION SYSTEM |
|
8" |
HORIBA |
PLLA-520 |
|
|
8" |
HORIZON |
4060X |
|
|
|
Ice |
HM 400SM ori 1002526-1 |
ICE LASER HANDLING- HEAD |
|
|
INOVYS |
Ocelot, tester |
512 PIN COUNT |
|
|
INOVYS |
Ocelot, tester |
256 DIGITAL PIN CHANNEL |
|
|
INSPEC |
DH14-MPC |
INSPEC PROJECTOR; Deltronic Comparator |
|
|
INSTRUMENTS SA |
JY-86 |
ICP-AES |
|
|
INTERCON |
MA4500 |
Trim and Form |
|
|
IN-TEST |
DAF-TR3340/90/MOEK |
TEST HEAD MANIPULATOR |
|
|
Ismeca |
Auto taping |
TMBZ ISMECA AUTO TAPING M/C |
|
|
ISMECA |
TMBZ-SP |
Tape & Reel |
|
|
ISMECA |
TNR-29 |
ISMECA S P TAPE & REEL MACHINE |
|
|
JEOL |
8065-4844 |
Power Conditioner |
|
8" |
JEOL |
JWS 7500E |
WAFER INSPECTION SYSTEM |
|
8" |
JEOL |
JWS 7700 |
WAFER INSPECTION SYSTEM |
|
8" |
Jeol |
JWS7500E, with EDX |
JWS7500E, EDX unit, single cassette |
|
8" |
Jeol |
JWS7700 |
SEM |
|
|
K&S |
382 |
Wafer Mounter |
|
|
K&S |
1472 |
Wire Bonder |
|
|
K&S |
1484 |
Wire Bonder (6 available) |
|
|
K&S |
1488 |
Wire Bonder (8 available) |
|
|
K&S |
132 PQFP |
FLEXLINE WIRE BONDER |
|
|
K&S |
1448LXQ |
Wire Bonder (3 available) |
|
|
K&S |
1484LXQ |
TURBO |
|
|
K&S |
1484XQ |
Wire Bonder |
|
|
K&S |
1488 Plus |
W/B FLEXLINE |
|
|
K&S |
1488 TURBO |
URBO FLEXLINE WIRE BONDER |
|
|
K&S |
1488L |
Wire bonder, Flex Line (3 available) |
|
|
K&S |
1488PLUS 2920W/H |
Wire Bonder |
|
|
K&S |
|
DICING SAW |
|
8" |
KEITHLEY |
NA |
KEITHLY QUANTOX |
|
|
Keller Tech |
keller tecnology corp |
Ball shear Bond tester |
|
8" |
KLA/TENCOR |
2133 |
Inspection Tool |
|
6" |
KLA/TENCOR |
1010 Ultrapoint |
Ultrapoint laser imaging system |
|
8" |
KLA/TENCOR |
FT500 |
FILM THICKNESS MEASUREMENT SYSTEM |
|
6" |
KLA/TENCOR |
KLA1011 ACE |
PROBER |
|
8" |
KLA/TENCOR |
P2H |
LONG SCAN PROFILER |
|
8" |
KLA/TENCOR |
Surfscan 6100 |
Bare Wafer Particle Monitor |
|
8" |
KLA/TENCOR |
Surfscan 6400 |
Particle Measurement Tool |
|
8" |
KLA/TENCOR |
Surfscan 6420 |
Particle Measurement Tool |
|
8" |
KLA/TENCOR |
VP-10 |
Versa Probe VP-10 Resistivity Tester |
|
6" |
Kodaira |
TK6002 |
Ink Drying Equipment |
|
|
KUWANO |
LT-930 |
VMFP/MFP KUWANO LT-930 AUTO HANDLER |
|
8" |
LAM |
Lam 4400 |
Nitride/Poly Etcher |
|
8" |
Lam |
Lam 4428 Poly Etch |
Poly etch tool |
|
6" |
LAM |
TE480 |
Etching System LAM-4807 |
|
6" |
Lam |
Lam 490-B Autoetch, Poly |
Poly and Nitride etching system |
|
|
LAMEDEA |
LLS9008 |
LAMEDEA POWER SUPPLY |
|
|
Lasermark |
1002 |
Laser mark |
|
6" |
LINTEC |
Lintec RAD-2500 M/8 |
Wafer Mounter |
|
|
Longhill |
Placement system |
Wafer Mounter |
|
8" |
Lumonics |
WMSC |
Wafermark Super Clean Laser Scribe |
|
|
Mactronix |
Eureka |
Wafer Transfer System |
|
|
MDA Scientific |
System 16 |
Toxic Gas Monitor |
|
8" |
Metricon |
2010 |
Film thickness measurement |
|
6" |
MGI |
Phoenix V4 |
Wafer Transfer System |
|
|
MICROMASS |
Plasma Therm 2 |
High resolution ICP-MS |
|
6" |
MICROVISION |
6'' Sorter |
Wafer sorter |
|
|
MKS |
Califlow |
A200 Primary Flow Standard, gas flow calibrator |
|
|
Motion Automation |
MA |
Wafer handler |
|
|
NEC |
Input handler |
NEC MAGAZINE INPUT HANDLER |
|
|
NEC |
Output handler |
NEC MAGAZINE OUTPUT HANDLER |
|
|
NEC |
Oven |
NEC Snapcure Oven |
|
|
Neslab |
Neslab HX-300 |
Chiller, air cooled |
|
6" |
NIKON |
G4 |
Photo |
|
6" |
Nikon |
NSR-1505G5D |
Stepper, Aligner NSR-1505G5D 17 |
|
|
NIKON |
VM-250 |
Video Measuring, 60x30x24" stand w/Nikon fiber optics |
|
|
NITTO |
NITTO M286N |
WAFER MOUNTER |
|
|
Polyflow S-310 |
S-310 |
Vertical tube cleaner |
|
|
Polylite |
88 |
POLYLITE 88 SCOPE |
|
8" |
PROMETRIX |
FT750 |
Metrology |
|
8" |
PROMETRIX |
N/A |
OMNIMAP |
|
8" |
PROMETRIX |
NC110 |
OMNIMAP |
|
|
Qtech |
Pick and place |
QTEC VISION AND PICK & PLACE |
|
|
RIGAKU |
3620 |
XRF |
|
|
Roos |
Gen 1 |
Tester |
|
|
RVSI |
LS-3950DB |
Scanner |
|
6" |
SANKYO |
SCC830A-69 |
Rinser Dryer |
|
|
SCHLUMBERGER |
Slumberger 1650 |
Slumberger 1650-5 |
|
6" |
Seiko |
SMI8800-SE |
Focused Ion Beam System SM18800SE |
|
6" |
Shibaura |
CDE-73 |
Etching System CDE7 10 |
|
|
Shinkawa |
SHINKAWA UTC250 |
Wirebonder |
|
|
Shinkawa |
SPA-20-D0-11 |
DIE BONDER |
|
|
Shinkawa |
SUPER UTC-205 |
Wire Bonder |
|
|
Shinkawa |
UTC 200 |
Wire Bonder |
|
|
Shinkawa |
UTC-205 |
Wire Bonder |
|
|
Shinkawa |
UTS-13 |
Wire Bonder |
|
|
Shinkawa |
UTS7 1010 |
Wire Bonder |
|
|
SIKAMA |
SIKAMA Furnace |
REFLOW |
|
6" |
SOLID STATE MEASURMENT INC |
MODEL 7 |
Desktop polishers |
|
|
Sputtered Films |
SFI-24 R&D |
Single chamber up-sputtering tool |
|
8" |
SPV |
2030 |
Surface PV |
|
|
TECHARMONIC |
HTVS |
High temperature venturi scrubber |
|
6-8" |
Tegal |
Tegal 903e |
Oxide etch |
|
|
TEL |
78S |
PROBER |
|
8" |
TEL |
ACT8 |
Spin on Dielectric Tool (single block with center stack) |
|
|
TEL |
J971 |
VLSI TESTER |
|
6" |
TEL |
J971 Headplate |
Standard J971 Headplate for TEL P8XL Prober |
|
|
TEL |
TEL Act 8 |
Spin coat station |
|
|
TEL |
Tel P8XL, P12XL |
Prober |
|
|
TERADYNE |
A585 |
Tester |
|
|
TERADYNE |
A590 BB |
Tester |
|
|
TERADYNE |
J971 |
VLSI TESTER |
|
|
TERADYNE |
J971-100 |
TESTER |
|
|
TERADYNE |
J971LC |
TERADYNE TEST SYSTEM |
|
|
Thermco |
VSM-520 |
Horizontal, 4stack furnace |
|
6" |
Toshiba |
APF |
Coating Developer (Positive) 17 |
|
12" |
Ultra Port |
Ultra Port |
Wafer handler |
|
8" |
ULTRAPOINTE |
LASER IMAGING SYSTEM |
Laser image |
|
6" |
Ultratech |
UltraStep 1100 |
Photo |
|
6" |
VARIAN |
300XP |
Ion Implanter |
|
8" |
VEECO |
Dektak 200 SL |
Profilometer |
|
6" |
VIKING |
Viking Model 1046 |
Tape/Reel System |
|
|
Vitronics |
Vitronics Multi Pro |
Oven |
|
8" |
VM |
VMT8 |
Verticle Wafer Transfer/Sorter Machine |
|
6" |
VTEK |
VTEK TM330 |
TAPING MACHINE |
|
|
WAKEFIELD |
W31 |
Wakefield (M03540) |
™
